May 20, 2025
Dutch Impulse Printing Startup FononTech Secures Grant from European Innovation Council to Advance Semiconductor Packaging Innovation
Eindhoven, The Netherlands –
FononTech a tech startup, known for its proprietary Impulse Printing technology, has secured a non-dilutive grant from the European Innovation Council (EIC) on May 19, 2025. The company, founded in 2022, specializes in producing ultra-fine patterns for electronics manufacturing and received this support under the EIC Accelerator program. The funding will be used to accelerate product development and deepen its market traction across Europe and Asia. While the exact amount of the grant has not been disclosed, the company previously raised €8.5M ($9.5M) in seed investment.
About FononTech
Founded to advance the future of semiconductor manufacturing, FononTech is pioneering a novel manufacturing method that enables high-speed, low-cost 3D interconnects for semiconductor packaging—a cornerstone for next-generation edge AI devices and miniaturized electronics. Its Impulse Printing technology offers a breakthrough alternative to traditional interconnect fabrication, positioning the startup as a key player in both the semiconductor and display industries.
Purpose of financing
The EIC grant will help FononTech finalize its first product and establish a stronger foothold in the market by supporting early deployments with major semiconductor companies. According to the company, this grant complements its strategic plan to scale operations and potentially open in-house production facilities in the near future.
FononTech, a spin-off from TNO Holst Centre and a former Gerard & Anton Award winner, is backed by investors including Sake Bosch, Innovation Industries, BOM, SHIFT Invest, and TNO. The company operates internationally with sales offices in South Korea, Japan, and North America, and boasts a robust IP portfolio that supports its ambition to reshape modern electronics manufacturing.
Founder’s Insights
Rob Hendriks, CEO and co-founder of FononTech, emphasized the momentum the company is gaining:
“With strong backing from the EIC and our investor network, we’ve been able to deliver our first machine to a global semiconductor customer within just two years. This new grant empowers us to maintain that speed and deepen customer relationships.”
CTO and co-founder Fabien Bruning, added:
“We’re seeing increasing interest from major players in the industry who view our technology as a solution to growing complexity in advanced packaging.”
Conclusion
With this latest milestone, FononTech continues its journey to become a global leader in advanced microfabrication solutions.
For updates, visit FononTech on LinkedIn.